Kaytus KR1280V2 Intel
The KR1280V2 series maximizes the performance, computing density, and scalability in a 1U space and is suitable for a variety of computing-intensive service scenarios such as high-performance computing and virtualization. With rich storage matrices, the KR1280V2 meets the needs of scalability and network balance to the greatest extent. It also satisfies the low-PUE needs of more high-density data centers by integrating multi-dimensional cooling solutions such as air cooling, cold plate cooling, and immersion cooling in the 1U models.
Built on the 4th Gen Intel® Xeon® Scalable processors, the KR1280V2 series supports up to 60 cores and 120 threads per CPU with a TDP of up to 350 W and a max Turbo frequency of 4.2 GHz through 4 UPI links at 16 GT/s.
Supports up to 32 DDR5 ECC DIMMs (4,800 MT/s, RDIMMs) to deliver high speeds and superior availability.
The KR1280V2 series supports up to 12 2.5-inch SAS/SATA/NVMe drives or 32 E1.S SSDs at the front, and up to 2 2.5-inch SAS/SATA drives at the rear (refer to the specific configurations).
Supports PCIe 5.0/4.0, up to 2 optional hot-swappable OCP 3.0, and provides 1 Gb, 10 Gb, 25 Gb, 40 Gb, 100 Gb, 200 Gb, and 400 Gb network interfaces.
With Compute Express Link (CXL), an open-source and standard cache-coherent interconnect protocol, and E3.S storage medium,
the KR1280V2 provides caching media in addition to traditional DIMMs to meet the core needs of large-capacity cache services.
The front I/O design enables O&M personnel to operate in the cold aisle, which simplifies O&M operations, extends the service life of thermo-sensitive components such as optical modules and smart NICs, and improves data stability.
The redundancy design of core components, such as the BIOS and BMC, ensures that the system can start by switching to the standby flash, ensure that the system can start by switching to the standby chip,and supports the online upgrade of the BMC without suspending services, thus guaranteeing service continuity.
Supports cold plate cooling and immersion cooling, and provides comprehensive liquid-cooling solutions for data centers. With full-stack liquid-cooling capabilities, the KR1280V2 series can drop the PUE of data centers to below 1.1.
By working with unique zonal intelligent control technology, the KR1280V2 series can adjust the fan speed intelligently based on
the power consumption of components in different air ducts, eliminating temperature transmission delays and realizing energy-saving fan speed regulation and accurate air supply.
With the focus on environmental protection, key components of the series meet the lead-free requirements (RoHS), and all packaging and packing materials are recyclable.
Item | Description | |
Form Factor | 1U rack server | |
Processor | up to two 4th Gen Intel® Xeon® scalable processors up to 60 cores, with a max Turbo frequency of 4,2 GHz 4 UPI links per CPU and up to 16 GT/s per link TDI up to 350W | |
Chipset | Intel Emmitsburg | |
Memory | Up to 32x DDR 5 DIMMs (4,800 MT/s) 16 DIMMs per CPU and 32 DIMMs for 2 CPU RDIMMs supported | |
Storage | General Front: 32x E1.S SSD 12x 2,5inch SAS/SATA/NVMe drive (up to 12 NVMe SSDs) 10x 2,5inch SAS/SATA/NVMe drive 8x 2,5inch SAS/SATA/NVMe drive + 2x M.2 SSD +2x E1.S SSD 4x 3.5 SAS/SATA/NVMe drive + 2x M.2 SSD + 2x E1.S SSD 4x 3,5inch SAS/SATA/NVMe drives + 4x 2,5inch SAS/SATA/NVMe drive | Front I/O Front: 12x E1.S SSD + 2x M.2 SSD 4x E3.S SSD/4x 2,5inch SAS/SATA/NVMe drive |
| Rear: 2x 2,5inch SAS/SATA drive (hot-swap) | Rear: – |
| Internal: Up to 3 TF cards, 1 for BMC, 2 for PCH Up to 2 SATA M.2 SSDs or 2 PCIe x4 M.2 SSDs | |
Storage Controller | RAID/SAS controller Onboard PCH that supports 14 SATA connectors Intel onboard NVMe controller and optional Intel NVMe RAID Key | |
Network | 2x optional hot-swap OCP 3.0 module | 3x optional hot-swap OCP 3.0 module |
I/O Expansion Slot | Up to 6 PCIe expansion slots, including 1 mezz RAID and 2 hot-swappable OCP 3.0 Up to 4 PCIe expansion slots for cold-plated configuration, including 2 hot-swappable OCP 3.0 | Up to 8 PCIe expansion slots, including 1 RAID mezzanine, 3 hot-swappable OCP 3.0 (1 for front, 2 for rear)
|
Port | Front: 1x USB 2.0 port, 1x USB 3.0 port, 1x DB15 VGA port, and 1x type-c port Rear: 2x USB 3.0 port, 1x DB15 VGA port, 1x COM port (Micro USB), 1x TJ45 port Internal: 1x USB 3.0 port | Front: 1x USB 2.0 port, 1x USB 3.0 port, 1x DB15 VGA port, and 1x RJ45 port Rear: 2x USB 3.0 port, 1x DB15 VGA port, 1x COM port (Micro USB), 1x TJ45 port Internal: 1x USB 3.0 port |
Fan | 8x hot-swap dual rotor fans with N+1 redundancy. (none for immersion-cooling models) | |
Power Supply | Supports 550W/800W/1300W/1600W/2000W CPRS standard PSUs with 1+1 redundancy | |
Security Feature | Two-factor authentication, TPM 2.0, security panel, intrusion alert, BIOS/BMC chipset-level redundancy, power capping, etc. |
|
System Management | Integrated with 1 independent 1,000 Mbps network port, dedicated for IPMI remote management |
|
Operating System | Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS, etc. | |
Dimensions (W x H x D) | 10 × 2.5-inch drive configuration (equipped with conventional heatsinks) With mounting ears: 43 × 482 × 830 mm (1.69 × 18.98 × 32.68 in.) Without mounting ears: 43 × 438 × 815 mm (1.69 × 17.24 × 32.09 in.) | |
| 12 × 2.5-inch drive configuration: With mounting ears: 43 × 482 × 881 mm (1.69 × 18.98 × 34.69 in.) Without mounting ears: 43 × 438 × 858 mm (1.69 × 17.24 × 33.78 in.) | |
| Other configurations: With mounting ears: 43 × 482 × 880 mm (1.69 × 18.98 × 34.65 in.) Without mounting ears: 43 × 438 × 865 mm (1.69 × 17.24 × 34.06 in.) | |
Weight | Full configuration: <31 kg (68.34 lbs) (For details, see the white paper) | |
Working Temperature | 5°C to 50°C (41°F to 122°F) (For details, see the white paper) | |